HUAWEI OptiX OSN 8800 T64/T32 Intelligent Optical Transport Platform. Product Description - part 56
Table 9-180 Latency specifications of the EAS2
Frame
Rate
Tx
Rx Frames
Min
Ave
Max
Size
Tested
Frames
(pks/sec)
Latency
Latency
Latency
(byte)
(%)
(pks/sec)
(us)
(us)
(us)
64
96.00000
14204544
14204544
24.4
25.681
27.9
128
96.00000
8116883
8116883
24.6
25.944
28.1
256
96.00000
4340277
4340277
25
26.322
28.5
512
96.00000
2256317
2256317
25.9
27.176
29.3
1024
96.00000
1148897
1148897
27.7
28.949
31.2
1280
96.00000
923190
923190
28.6
29.802
32
1518
96.00000
780274
780274
29.4
30.562
32.8
Mechanical Specifications
The mechanical specifications of the EAS2 board are as follows:
l Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)
l Weight (kg): 1.1
Power Consumption
The maximum power consumption of the EAS2 at room temperature (25°C) is 78 W.
The maximum power consumption of the EAS2 at high temperature (55°C) is 91 W.
9.7 Cross-connect Unit Specifications
9.7.1 TN52XCH Specifications
Specifications include dimensions, weight, and power consumption.
Mechanical Specifications
l Dimensions of the front panel: 27.9 mm (W) x 220 mm (D) x 581.5 mm (H) or 1.1 in. (W)
x 8.7 in. (D) x 22.9 in. (H)
l Weight: 3.40 kg (7.49 lb.)
598
Power Consumption
Board
Power
Power
Typical Power
Maximum
Consumption
Consumption
Consumption
Power
at Warm
at Warm
at 25°C (77°F)
Consumption
Backup (25°C,
Backup (55°C,
(W)
at 55°C (131°F)
77°F) (W)
131°F) (W)
(W)
TN52XCH01
65
72
243 - 3.6 x (32 -
267.3 - 3.6 x (32
n)
- n)
TN52XCH02
43
47.3
101 - 1.12 x (32
111 - 1.12 x (32
- n)
- n)
NOTE
"n" is equal to the total number of tributary, line, and PID boards housed in a subrack.
9.7.2 XCM Board Specifications
Specifications include dimensions, weight, and power consumption.
Mechanical Specifications
l Dimensions of the front panel: 27.2 mm (W) x 220 mm (D) x 581.5 mm (H) or 1.1 in. (W)
x 8.7 in. (D) x 22.9 in. (H)
l Weight: 3.84 kg (8.45 lb.)
Power Consumption
Board
Power
Power
Typical Power
Maximum
Consumption
Consumption
Consumption
Power
at Warm
at Warm
at 25°C (77°F)
Consumption
Backup (25°C,
Backup (55°C,
(W)
at 55°C (131°F)
77°F) (W)
131°F) (W)
(W)
TN52XCM01
125
138
339 - 3.6 x (32 -
368 - 3.6 x (32 -
n) -80 x m
n) -80 x m
TN52XCM02
67
73.7
124 - 1.12 x (32
136.4 - 1.12 x
- n) -80 x m
(32 - n) -80 x m
NOTE
"n" is equal to the total number of tributary, line, and PID boards housed in a subrack.
l If a subrack is configured with VC-3 or VC-12 cross-connections, "m" is equal to 0.
l If a subrack is not configured with any VC-3 or VC-12 cross-connections, "m" is equal to 1.
9.7.3 XCT Specifications
Specifications include dimensions, weight, and power consumption.
599
Mechanical Specifications
TNK2XCT:
l Dimensions of front panel: 34.1 mm (W) x 220 mm (D) x 602.5 mm (H) (1.4 in. (W) x 8.7
in. (D) x 23.7 in. (H))
l Weight: 3.6 kg (7.9 lb.)
Power Consumption
Board
Power
Power
Typical Power
Maximum
Consumption
Consumption
Consumption
Power
at Warm
at Warm
at 25°C (77°F)
Consumption
Backup (25°C,
Backup (55°C,
(W)
at 55°C (131°F)
77°F) (W)
131°F) (W)
(W)
TNK2SXM
190
209
530-3.6 x (64-
583-3.6 x (64-
+TNK2XCT
n)
n)
TNK2SXH
130
143
470-3.6 x (64-
517-3.6 x (64-
+TNK2XCT
n)
n)
TNK4SXM
97
107
188-1.2 x (64-
207-1.32 x (64-
+TNK4XCT
n)
n)
TNK4SXH
95
105
169-1.2 x (64-
186-1.32 x (64-
+TNK4XCT
n)
n)
TNK2SXM
173
190
378-2.5 x (64-
416-2.5 x (64-
+TNK4XCT
n)
n)
TNK4SXM
114
125
324-2.5 x (64-
356-2.5 x (64-
+TNK2XCT
n)
n)
TNK2SXH
113
124
318-2.5 x (64-
350-2.5 x (64-
+TNK4XCT
n)
n)
TNK4SXH
112
123
321-2.5 x (64-
353-2.5 x (64-
+TNK2XCT
n)
n)
NOTE
When the OptiX OSN 8800 T64 subrack grooms electrical-layer signals through the backplane, the
SXM/SXH and XCT must be configured.
"n" is equal to the total number of tributary, line, and PID boards housed in a subrack.
9.7.4 SXM Specifications
Specifications include dimensions, weight, and power consumption.
Mechanical Specifications
TNK2SXM:
600
l Dimensions of front panel: 34.1 mm (W) x 220 mm (D) x 602.5 mm (H) or 1.4 in. (W) x
8.7 in. (D) x 23.7 in. (H)
l Weight: 3.74 kg (8.2lb.)
TNK4SXM:
l Dimensions of front panel: 34.1 mm (W) x 220 mm (D) x 602.5 mm (H) or 1.4 in. (W) x
8.7 in. (D) x 23.7 in. (H)
l Weight: 3.00 kg (6.59b.)
Power Consumption
Board
Power
Power
Typical Power
Maximum
Consumption
Consumption
Consumption
Power
at Warm
at Warm
at 25°C (77°F)
Consumption
Backup (25°C,
Backup (55°C,
(W)
at 55°C (131°F)
77°F) (W)
131°F) (W)
(W)
TNK2SXM
190
209
530-3.6 x (64-
583-3.6 x (64-
+TNK2XCT
n)
n)
TNK4SXM
97
107
188-1.2 x (64-
207-1.32 x (64-
+TNK4XCT
n)
n)
TNK2SXM
173
190
378-2.5 x (64-
416-2.5 x (64-
+TNK4XCT
n)
n)
TNK4SXM
114
125
324-2.5 x (64-
356-2.5 x (64-
+TNK2XCT
n)
n)
NOTE
When the OptiX OSN 8800 T64 subrack grooms electrical-layer signals through the backplane, the SXM
and XCT must be configured.
"n" is equal to the total number of tributary, line, and PID boards housed in a subrack.
9.7.5 SXH Specifications
Specifications include dimensions, weight, and power consumption.
Mechanical Specifications
TNK2SXH:
l Dimensions of front panel: 34.1 mm (W) x 220 mm (D) x 602.5 mm (H) or 1.4 in. (W) x
8.7 in. (D) x 23.7 in. (H)
l Weight: 3.74 kg (8.1lb.)
TNK4SXH:
l Dimensions of front panel: 34.1 mm (W) x 220 mm (D) x 602.5 mm (H) or 1.4 in. (W) x
8.7 in. (D) x 23.7 in. (H)
l Weight: 2.68 kg (5.8Ib.)
601
Power Consumption
Board
Power
Power
Typical Power
Maximum
Consumption
Consumption
Consumption
Power
at Warm
at Warm
at 25°C (77°F)
Consumption
Backup (25°C,
Backup (55°C,
(W)
at 55°C (131°F)
77°F) (W)
131°F) (W)
(W)
TNK2SXH
130
143
470-3.6 x (64-
517-3.6 x (64-
+TNK2XCT
n)
n)
TNK4SXH
95
105
169-1.2 x (64-
186-1.32 x (64-
+TNK4XCT
n)
n)
TNK2SXH
113
124
318-2.5 x (64-
350-2.5 x (64-
+TNK4XCT
n)
n)
TNK4SXH
112
123
321-2.5 x (64-
353-2.5 x (64-
+TNK2XCT
n)
n)
NOTE
When the OptiX OSN 8800 T64 subrack grooms electrical-layer signals through the backplane, the SXH
and XCT must be configured.
"n" is equal to the total number of tributary, line, and PID boards housed in a subrack.
9.8 Optical Multiplexer Unit and Demultiplexer Unit
Specifications
9.8.1 D40 Specifications
Specifications include optical specifications, dimensions, weight and power consumption.
Optical Specifications
Table 9-181 lists the optical specifications of the D40.
Table 9-181 Optical specifications of the D40
Item
Unit
Value
Adjacent channel spacing
GHz
100
Insertion loss
dB
≤ 6.5
Reflectance
dB
< -40
Operating wavelength range
nm
1529-1561
Adjacent channel isolation
dB
> 25
Non-adjacent channel isolation
dB
> 25
602
Item
Unit
Value
Polarization dependent loss
dB
≤ 0.5
Temperature characteristics
nm/°C
< 0.002
Maximum channel insertion loss difference
dB
≤ 3
-1 dB bandwidth
nm
≥ 0.2
-20 dB bandwidth
nm
< 1.4
Mechanical Specifications
l Dimensions of front panel:
- TN11D40: 76.2 mm (W) x 220 mm (D) x 264.6 mm (H) (3.0 in. (W) x 8.7 in. (D) x
10.4 in. (H))
- TN12D40: 50.8 mm (W) x 220 mm (D) x 264.6 mm (H) (2.0 in. (W) x 8.7 in. (D) x
10.4 in. (H))
l Weight:
- TN11D40: 2.2 kg ( 4.8 lb.)
- TN12D40: 2.0 kg ( 4.4 lb.)
Power Consumption
Board
Typical Power
Maximum Power
Consumption at 25°C (77°
Consumption at 55°C
F) (W)
(131°F) (W)
TN11D40
10.0
13.0
TN12D40
10.0
13.0
9.8.2 D40V Specifications
Specifications include optical specifications, dimensions, weight, and power consumption.
Optical Specifications
Table 9-182 lists the optical specifications of the D40V board.
Table 9-182 Optical specifications of the D40V board
Item
Unit
Value
Adjacent channel spacing
GHz
100
Insertion loss
dB
≤ 8a
603
Item
Unit
Value
Reflectance
dB
< -40
Operating wavelength range
nm
1529-1561
Adjacent channel isolation
dB
> 25
Non-adjacent channel isolation
dB
> 30
Attenuation range
dB
0-15
Loss accuracy
dB
≤ 1 (0 to 10 dB)
≤ 1.5 (>10 dB)
Polarization dependent loss
dB
≤ 0.5
Maximum channel insertion loss difference
dB
≤ 3a
NOTE
a: This value can be reached when the attenuation of the VOA is set to 0 dB.
Mechanical Specifications
l Dimensions of front panel: 76.2 mm (W) x 220 mm (D) x 264.6 mm (H) (3.0 in. (W) x 8.7
in. (D) x 10.4 in. (H))
l Weight: 2.3 kg (5.1 lb.)
Power Consumption
Board
Typical Power
Maximum Power
Consumption at 25°C (77°
Consumption at 55°C
F) (W)
(131°F) (W)
D40V
38.5
42.3
9.8.3 FIU Specifications
Specifications include optical specifications, dimensions, weight, and power consumption.
Optical Specifications
Table 9-183 Optical specifications of the FIU board
Interface
Item
Unit
Value
-
Operating wavelength
nm
1529-1561
range
604
Interface
Item
Unit
Value
-
Operating wavelength
nm
1500-1520
range of optical
supervisory channel
-
Optical return loss
dB
> 40
IN-TM
Insertion loss
dB
≤ 1.5
RM-OUT
IN-TC
Insertion loss
dB
≤ 1
RC-OUT
IN-TM
Isolation
dB
> 40
IN-TC
Isolation
dB
> 12
-
Polarization dependent
dB
< 0.2
loss
Mechanical Specifications
TN12/TN13FIU:
l Dimensions of front panel: 25.4 mm (W) x 220 mm (D) x 264.6 mm (H) (1.0 in. (W) x 8.7
in. (D) x 10.4 in. (H))
l Weight: 1.0 kg (2.2 lb.)
Power Consumption
Board
Typical Power
Maximum Power
Consumption at 25°C (77°
Consumption at 55°C
F) (W)
(131°F) (W)
TN11FIU/TN12FIU
4.2
4.6
TN13FIU/TN21FIU
0.2
0.3
9.8.4 ITL Specifications
Specifications include optical specifications, dimensions, weight, and power consumption.
Optical Specifications
Table 9-184 Optical specifications of the TN11ITL01
Item
Unit
Value
Input channel spacinga
-
GHz
100
605
Item
Unit
Value
Output channel spacinga
-
GHz
50
Insertion loss
RE-OUT
dB
< 4.5
RO-OUT
IN-TE
dB
< 2.5
IN-TO
Maximum channel insertion loss difference
dB
< 1
Isolation
IN-TE
dB
> 25
IN-TO
Maximum reflectance
-
dB
-40
Directivity
-
dB
> 45
PMD
-
ps
< 0.5
Polarization dependent loss
-
dB
< 0.5
Input optical power range
-
dBm
≤ 26
a: The input and output ends are defined based on the multiplexing process of the interleaver.
Table 9-185 Optical specifications of the TN11ITL04
Item
Unit
Value
Input channel spacinga
-
GHz
100
Output channel spacinga
-
GHz
50
Insertion loss
RE-OUT
dB
< 3
RO-OUT
IN-TE
dB
< 3
IN-TO
Maximum channel insertion loss difference
dB
< 1
Isolation
IN-TE
dB
> 25
IN-TO
Maximum reflectance
-
dB
-40
Directivity
-
dB
> 45
PMD
-
ps
< 0.5
Polarization dependent loss
-
dB
< 0.5
Input optical power range
-
dBm
≤ 26
606
Item
Unit
Value
a: The input and output ends are defined based on the multiplexing process of the interleaver.
Table 9-186 Optical specifications of the TN12ITL
Item
Unit
Value
Input channel spacinga
-
GHz
100
Output channel spacinga
-
GHz
50
Insertion loss
RE-OUT
dB
< 4.5
RO-OUT
IN-TE
dB
< 3.5
IN-TO
Maximum channel insertion loss difference
dB
< 1
Isolation
IN-TE
dB
> 22
IN-TO
Maximum reflectance
-
dB
-40
Directivity
-
dB
> 45
PMD
-
ps
< 0.5
Polarization dependent loss
-
dB
< 0.5
Input optical power range
-
dBm
≤ 23
a: The input and output ends are defined based on the multiplexing process of the interleaver.
Mechanical Specifications
l Dimensions of front panel: 25.4 mm (W) x 220 mm (D) x 264.6 mm (H) (1.0 in. (W) x 8.7
in. (D) x 10.4 in. (H))
l Weight: 1.2 kg (2.7 lb.)
Power Consumption
Board
Typical power
Maximum power
consumption at 25°C (77°
consumption at 55°C
F) (W)
(131°F) (W)
TN11ITL
0.2
0.3
TN12ITL
10.0
11.5
607
9.8.5 M40 Specifications
Specifications include optical specifications, dimensions, weight, and power consumption.
Optical Specifications
Table 9-187 lists the optical specifications of the M40 board.
Table 9-187 Optical specifications of the M40 board
Item
Unit
Value
Adjacent channel spacing
GHz
100
Insertion loss
dB
≤ 6.5
Reflectance
dB
< -40
Operating wavelength range
nm
1529-1561
Adjacent channel isolation
dB
> 22
Non-adjacent channel isolation
dB
> 25
Polarization dependence loss
dB
≤ 0.5
Temperature characteristics
nm/°C
≤ 0.002
Maximum channel insertion loss difference
dB
≤ 3
Mechanical Specifications
l Dimensions of front panel:
- TN11M40: 76.2 mm (W) x 220 mm (D) x 264.6 mm (H) (3.0 in. (W) x 8.7 in. (D) x
10.4 in. (H))
- TN12M40: 50.8 mm (W) x 220 mm (D) x 264.6 mm (H) (2.0 in. (W) x 8.7 in. (D) x
10.4 in. (H))
l Weight:
- TN11M40: 2.2 kg ( 4.8 lb.)
- TN12M40: 2.0 kg ( 4.4 lb.)
Power Consumption
Board
Typical Power
Maximum Power
Consumption at 25°C (77°
Consumption at 55°C
F) (W)
(131°F) (W)
TN11M40
10.0
13.0
TN12M40
10.0
13.0
608